Optical modules in AI servers are mainly used in GPU/TPU interconnects, rack-level networking, and large-scale data center connections to enable high-speed, low-latency communication.Scale-Up Intercon...
In AI servers, scale-up interconnects connect GPUs, TPUs, or other accelerators within a single rack or tightly coupled cluster. Optical modules are increasingly replacing copper links in these environments to overcome bandwidth limitations and reduce latency. Co-packaged optics (CPO) and Optical Compute Interconnects (OCI) are deployed directly alongside switches and XPUs to support high-bandwidth, low-latency communication between accelerators, enabling efficient parallel computation and minimizing bottlenecks during model training .
For scale-out applications, optical modules connect multiple racks across hyperscale AI data centers. Copper cabling is insufficient for distances beyond a few meters, so optical interconnects are essential for maintaining high-speed data transfer between thousands of servers. Pluggable optical modules supporting 100 Gbps to 200 Gbps PAM4 signaling are commonly used, often incorporating components like Digital Signal Processors (DSPs), Transmit Optical Sub-Assemblies (TOSA), and Receive Optical Sub-Assemblies (ROSA) to ensure signal integrity and efficient transmission .
Optical modules also play a critical role in AI cluster networking, connecting GPU servers, storage systems, and switches. High-speed transceivers such as QSFP-DD and OSFP modules enable 400G and 800G connectivity, supporting massive east-west traffic generated during distributed AI training and inference. These modules convert electrical signals to optical signals for transmission over fiber, reducing power consumption, heat generation, and latency compared to copper cabling .
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